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专利名称：Back-illuminated image sensor and method
of fabricating the same
发明人：Sung-Ho Hwang,Duck-Hyung Lee,Chang-Rok
Moon,Doo-Won Kwon
申请号：US11987607申请日：20071203公开号：US07750280B2公开日：20100706
专利附图：
摘要：A back-illuminated image sensor may include a substrate in which photodiodesare disposed; an insulating layer on a first surface of the substrate; an interconnection
layer in the insulating layer; an anti-reflection layer between the substrate and theinsulating layer; a plurality of color filters on a second surface of the substrate oppositeto the first surface; and a microlens on the color filters. Because the anti-reflection layermay be between the substrate and an interlayer dielectric layer, the reflection rate oflight that passes through the substrate and arrives at an interface between the substrateand the interlayer insulating layer may be reduced.
申请人：Sung-Ho Hwang,Duck-Hyung Lee,Chang-Rok Moon,Doo-Won Kwon
地址：Seoul KR,Seongnam-si KR,Seoul KR,Seongnam-si KR
国籍：KR,KR,KR,KR
代理机构：Harness, Dickey & Pierce, L.L.C.
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